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The need for good packaging of MEMS and MST products is expanding. The package is one of the most important elements of a micro device, as it protects the functional unit (sensor, integrated circuit or micromechanical components) against harming influences.
Wafer Level Packaging
Micronit supplies
a wide range of possibilities in wafer scale packaging. We are able to make
structured glass and silicon wafers up to 12 inch, with through holes, cavities,
structures or trenches and electrical contact pads. Hole density is of no
importance. The wafers can be made of different glass types.
Advantages
Using glass wafers for wafer
scale packaging has very advantageous characteristics, as they are:
- optically 100% clear;
- made from non conducting material;
- relatively easy to manufacture and to scale up;
- same temperature coefficient as silicon, which makes bonding possible without glue or adhesives;
- more economical than structured silicon wafers.
Compared to ultrasonic drilling, structured wafers have much better tolerances in hole-to-hole distance. There is no limitation on the number of holes or cavities.
Specifications
Micronit has standard
wafers in its product portfolio, but a customized design can be manufactured,
too. In the table below the capabilities of our wafer production is given.
| Powderblasting | HF Etching | |
|
Feature Size |
> 50 µm |
> 5 µm 0.1 - 100 µm 1:2 approx. 0.1 µm 100% clear 4", 5", 6" (round and square) |
| Integration of metal layers Material Shapes / Structures Wafer thickness |
Pt (standard), Au, Cu or other borosilicate, fused silica, silicon or combinations any designed structure 1,100 µm, 700 µm, 400 µm, 175 µm or 100 µm |
Contact our sales engineers for more information.