Deep Reactive Ion Etching (DRIE or plasma etching) is a unique technique to create deep, high density and high aspect ratio structures in glass (fused silica) and silicon substrates. Micronit is one of the few companies able to use the DRIE method in glass substrates.

Capabilities
Etching with steep side walls (anisotropic etching) as well as with rounded walls (isotropic etching) in substrates is possible, with depths varying between 1 µm cavities and complete wafer-through holes.

Capabilities of Micronit in RIE etching are as follows:

• Aspect ratio 1:15;
• Wafer-through etching;
• Variable inclination of the channel walls;
• DRIE on SOI wafers.